Competitive
Analysis
Logic Product Development Project
Device SN74LVC1G17DCK
Function Schmidt Trigger
Buffer
Competitor TI
Package DCK SOT353
SC-70
Die Size 509u X 494u cut size
Bond Pads 86 X 86 microns.
Die Orientation Active Surface Down (uses die that
normally faces down)
Technology LVC
5.5V to 1.65v
An online all
layer GIMP compatible photo set is on the server.
|
Die Photo Metal 2 |
|
|
|
|
|
|
|
|
|
Die Overview
Observations: Photo
– High Resolution |
|
|
|
|
|
Die Photo Metal 1 |
|
|
|
|
|
|
|
|
|
Die Overview
Photo
– High Resolution |
|
|
|
|
|
Die Photo Poly Level |
|
|
|
|
|
|
|
|
|
Die Overview
Photo –
High Resolution |
|
|
|
|
|
Die Photo Diffusion Level |
|
|
|
|
|
|
|
|
|
Die Overview
Photo
– High Resolution |
|
|
|
|
|
Package Information TI
SN74LVC1G17DCK SOT353 |
||
|
|
Top View
|
|
|
|
Bottom of package
with mold compound removed
This die has the pads oriented for a die downward application.
Note the pinout seems to differ since the photo on the left is a bottom view. |
|
|
|
